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This is a list of microprocessors designed by Advanced Micro Devices, under the AMD Accelerated Processing Unit product series.

• 3Desktop APUs
• 4Server APUs
• 5Mobile APUs
• 6Ultra-mobile APUs
  • 6.4'Kabini', 'Temash' (2013)
  • 6.5'Beema', 'Mullins' (2014)
• 7Embedded APUs
  • 7.1G-Series
  • 7.2R-Series

Feature overview[edit]

1. ^APU models: A8-7680, A6-7480. CPU only: Athlon X4 845.
2. ^Unified shaders : texture mapping units : render output units
3. ^To feed more than two displays, the additional panels must have native DisplayPort support.^[7] Alternatively active DisplayPort-to-DVI/HDMI/VGA adapters can be employed.
4. ^To play protected video content, it also requires card, operating system, driver, and application support. A compatible HDCP display is also needed for this. HDCP is mandatory for the output of certain audio formats, placing additional constraints on the multimedia setup.
5. ^ ^abDRM (Direct Rendering Manager) is a component of the Linux kernel. Support in this table refers to the most current version.

Graphics API overview[edit]

The following table shows the graphics and compute APIs support across Radeon-branded GPU microarchitectures. Note that a branding series might include older generation chips.

1. ^Radeon 7000 Series has programmable pixel shaders, but do not fully comply with DirectX 8 or Pixel Shader 1.0. See article on R100's pixel shaders.
2. ^These series do not fully comply with OpenGL 2+ as the hardware does not support all types of non-power-of-two (NPOT) textures.
3. ^OpenGL 4+ compliance requires supporting FP64 shaders and these are emulated on some TeraScale chips using 32-bit hardware.

^[16][17][18]

Desktop APUs[edit]

Lynx: 'Llano' (2011)[edit]

• Socket FM1
• CPU: K10^{[citation needed]} (or Husky^{[citation needed]} or K10.5^{[citation needed]}) with no L3 cache cores with an upgraded architecture known as Stars^{[citation needed]}
• MMX, Enhanced 3DNow!, SSE, SSE2, SSE3, SSE4a, ABM, NX bit, AMD64, Cool'n'Quiet, AMD-V
• GPU: TeraScale 2 (Evergreen); all A and E series models feature Redwood-class integrated graphics on die (BeaverCreek for the dual-core variants and WinterPark for the quad-core variants). Sempron and Athlon models exclude integrated graphics.^[19]
• Support for up to four DIMMs of up to DDR3-1866 memory
• Fabrication 32 nm on GlobalFoundriesSOI process; Die size: 228 mm², with 1.178 billion transistors^[20][21]
• 5 GT/s UMI
• Integrated PCIe 2.0 controller
• Select models support Turbo Core technology for faster CPU operation when the thermal specification permits
• Select models support Hybrid Graphics technology to assist a discrete Radeon HD 6450, 6570, or 6670 discrete graphics card. This is similar to the current Hybrid CrossFireX technology available in the AMD 700 and 800 chipset series

Virgo: 'Trinity' (2012)[edit]

• Fabrication 32 nm on GlobalFoundries SOI process
• Socket FM2
• CPU: Piledriver
• GPU TeraScale 3 (VLIW4)
• Die Size: 246 mm², 1.303 Billion transistors^[22]
• Support for up to four DIMMs of up to DDR3-1866 memory
• 5 GT/s UMI
• GPU (based on VLIW4 architecture) instruction support: DirectX 11, Opengl 4.2, DirectCompute, Pixel Shader 5.0, Blu-ray 3D, OpenCL 1.2, AMD Stream, UVD3
• Integrated PCIe 2.0 controller, and Turbo Core technology for faster CPU/GPU operation when the thermal specification permits
• MMX, SSE, SSE2, SSE3, SSSE3, SSE4a, SSE4.1, SSE4.2, AMD64, AMD-V, AES, CLMUL, AVX 1.1, XOP, FMA3, FMA4, F16C^[23], ABM, BMI1, TBM
• Sempron and Athlon models exclude integrated graphics
• Select models support Hybrid Graphics technology to assist a Radeon HD 7350, 7450, 7470, 7550, 7570, 7670 discrete graphics card.^[24][25] However, it has been found that this does not always improve 3D accelerated graphics performance.^[26][27]

'Richland' (2013)[edit]

• Fabrication 32 nm on GlobalFoundries SOI process
• Socket FM2
• CPU
  • Piledriver architecture
  • 2 cores per module
  • L1 Cache: 16 KB Data per core and 64 KB Instructions per module
  • MMX, SSE, SSE2, SSE3, SSSE3, SSE4a, SSE4.1, SSE4.2, AMD64, AMD-V, AES, AVX, AVX1.1, XOP, FMA3, FMA4, F16C, ABM, BMI1, TBM, Turbo Core 3.0, NX bit
• GPU
  • TeraScale 3 architecture
  • HD Media Accelerator, AMD Hybrid Graphics

'Kabini' (2013, SoC)[edit]

• Fabrication 28 nm by GlobalFoundries
• Socket AM1, aka Socket FS1b (AM1 platform)
• 2 to 4 CPU Cores (Jaguar (microarchitecture))
• MMX, SSE, SSE2, SSE3, SSSE3, SSE4a, SSE4.1, SSE4.2, AMD64, AVX, F16C, CLMUL, AES, MOVBE (Move Big-Endian instruction), XSAVE/XSAVEOPT, ABM, BMI1, AMD-V support
• SoC with integrated memory, PCIe, 2× USB 3.0, 6× USB 2.0, Gigabit Ethernet, and 2× SATA III (6 Gb/s) controllers
• GPU based on Graphics Core Next (GCN)

'Kaveri' (2014)[edit]

• Fabrication 28 nm by GlobalFoundries
• Socket FM2+,^[33] support for PCIe 3.0
• Two or four CPU cores based on the Steamroller microarchitecture
  • Kaveri refresh models have codename Godavari^[34]
• MMX, SSE, SSE2, SSE3, SSSE3, SSE4.1, SSE4.2, SSE4a, AMD64, AMD-V, AES, CLMUL, AVX, AVX 1.1, XOP, FMA3, FMA4, F16C, ABM, BMI1, TBM, Turbo Core
• Three to eight Compute Units (CUs) based on GCN 2nd gen microarchitecture;^[35] 1 Compute Unit (CU) consists of 64 Unified Shader Processors : 4 Texture Mapping Units (TMUs) : 1 Render Output Unit (ROPs)
• Heterogeneous System Architecture-enabled zero-copy through pointer passing
• SIP blocks: Unified Video Decoder, Video Coding Engine, TrueAudio^[36]
• Dual-channel (2× 64 Bit) DDR3 memory controller
• Integrated custom ARM Cortex-A5 co-processor^[37] with TrustZone Security Extensions^[38]
• Select models support Hybrid Graphics technology by using a Radeon R7 240 or R7 250 discrete graphics card^[39]
• Display controller: AMD Eyefinity 2, 4K Ultra HD support, DisplayPort 1.2 Support^[40]

'Carrizo' (2016)[edit]

• Fabrication 28 nm by GlobalFoundries
• Socket FM2+, AM4, support for PCIe 3.0
• Two or four CPU cores based on the Excavator microarchitecture
• MMX, SSE, SSE2, SSE3, SSSE3, SSE4.1, SSE4.2, SSE4a, AMD64, AMD-V, AES, CLMUL, AVX, AVX 1.1, AVX2, XOP, FMA3, FMA4, F16C, ABM, BMI1, BMI2, TBM, RdRand, Turbo Core
• Dual-channel DDR4 memory controller
• Third Generation GCN based GPU

'Bristol Ridge' (2016)[edit]

• Fabrication 28 nm by GlobalFoundries
• Socket AM4, support for PCIe 3.0
• Two or Four CPU cores based on the Excavator microarchitecture
• MMX, SSE, SSE2, SSE3, SSSE3, SSE4.1, SSE4.2, SSE4a, AMD64, AMD-V, AES, CLMUL, AVX, AVX 1.1, AVX2, XOP, FMA3, FMA4, F16C, ABM, BMI1, BMI2, TBM, RdRand, Turbo Core
• Dual-channel DDR4 memory controller
• PCI Express 3.0 x8 (No Bifurcation support, requires a PCI-e switch for any configuration other than x8)
• PCI Express 3.0 x4 as link to optional external chipset
• 4x USB 3.1 Gen 1
• Storage: 2x SATA and 2x NVMe or 2x PCI Express
• Third Generation GCN based GPU^[42] with hybrid VP9 decoding

'Raven Ridge' (2018)[edit]

• Fabrication 14 nm by GlobalFoundries
• Transistors: 4.95 billion
• Die size: 210 mm²
• Zen CPU cores
• MMX, SSE, SSE2, SSE3, SSSE3, SSE4.1, SSE4.2, SSE4a, AMD64, AMD-V, AES, CLMUL, AVX, AVX 1.1, AVX2, FMA3, F16C, ABM, BMI1, BMI2, RdRand, Turbo Core
• Dual-channel DDR4 memory controller
• Fifth generation GCN based GPU
• Video Core Next (VCN) 1.0

1. ^AMD defines 1 kilobyte (KB) as 1024 bytes, and 1 megabyte (MB) as 1024 kilobytes.^[44]
2. ^Unified Shaders : Texture Mapping Units : Render Output Units and Compute Units (CU)
3. ^Single-precision performance is calculated from the base (or boost) core clock speed based on a FMA operation.

Server APUs[edit]

Opteron X2100-series 'Kyoto' (2013)[edit]

• Fabrication 28 nm
• Socket FT3 (BGA)
• 4 CPU Cores (Jaguar (microarchitecture))
• MMX, SSE, SSE2, SSE3, SSSE3, SSE4a, SSE4.1, SSE4.2, AVX, F16C, CLMUL, AES, MOVBE (Move Big-Endian instruction), XSAVE/XSAVEOPT, ABM, BMI1, AMD-V support
• Turbo Dock Technology, C6 and CC6 low power states
• GPU based on GCN (Graphics Core Next) architecture

Opteron X3000-series (2017)[edit]

• Fabrication 28 nm
• Two or Four CPU cores based on the Excavator microarchitecture^[62][63]
• MMX, SSE, SSE2, SSE3, SSSE3, SSE4.1, SSE4.2, SSE4a, AMD64, AMD-V, AES, CLMUL, AVX, AVX 1.1, AVX2, XOP, FMA3, FMA4, F16C, ABM, BMI1, BMI2, TBM, RdRand
• GPU based on 3rd Generation GCN (Graphics Core Next) architecture

Mobile APUs[edit]

Sabine: 'Llano' (2011)[edit]

• Fabrication 32 nm on GlobalFoundriesSOI process
• Socket FS1
• Upgraded Stars (AMD 10h architecture) codenamed Husky^{[citation needed]} CPU cores (K10.5^{[citation needed]}) with no L3 cache, and with Redwood-class integrated graphics on die (BeaverCreek for the dual-core variants and WinterPark for the quad-core variants)
• Integrated PCIe 2.0 controller
• GPU: TeraScale 2
• Select models support Turbo Core technology for faster CPU operation when the thermal specification permits
• Support for 1.35 V DDR3L-1333 memory, in addition to regular 1.5 V DDR3 memory specified
• 2.5 GT/s UMI
• MMX, Enhanced 3DNow!, SSE, SSE2, SSE3, SSE4a, ABM, NX bit, AMD64, AMD-V

Comal: 'Trinity' (2012)[edit]

• Fabrication 32 nm on GlobalFoundries SOI process
• Socket FS1r2, FP2
• Based on the Piledriver architecture
• GPU: TeraScale 3 (VLIW4)
• MMX, SSE, SSE2, SSE3, SSSE3, SSE4.1, SSE4.2, SSE4a, AMD64, AMD-V, AES, CLMUL, AVX, AVX 1.1, XOP, FMA3, FMA4, F16C, ABM, BMI1, TBM, Turbo Core
• Memory support: 1.35 V DDR3L-1600 memory, in addition to regular 1.5 V DDR3 memory specified (Dual-channel)
• 2.5 GT/s UMI
• Transistors: 1.303 billion
• Die size: 246 mm²

'Richland' (2013)[edit]

• Fabrication 32 nm on GlobalFoundries SOI process
• Socket FS1r2, FP2
• Elite Performance APU.^[65][66]
• CPU: Piledriver architecture
• GPU: TeraScale 3 (VLIW4)
• MMX, SSE, SSE2, SSE3, SSSE3, SSE4.1, SSE4.2, SSE4a, AMD64, AMD-V, AES, CLMUL, AVX, AVX 1.1, XOP, FMA3, FMA4, F16C, ABM, BMI1, TBM, Turbo Core

'Kaveri' (2014)[edit]

• Fabrication 28 nm
• Socket FP3
• Up to 4 'Steamroller' x86 CPU cores with 4 MB of L2 cache.^[67]
• MMX, SSE, SSE2, SSE3, SSSE3, SSE4.1, SSE4.2, SSE4a, AMD64, AMD-V, AES, CLMUL, AVX, AVX 1.1, XOP, FMA3, FMA4, F16C, ABM, BMI1, TBM, Turbo Core
• Three to eight Compute Units (CUs) based on Graphics Core Next (GCN)^[35] microarchitecture; 1 Compute Unit (CU) consists of 64 Unified Shader Processors : 4 Texture Mapping Units (TMUs) : 1 Render Output Unit (ROPs)
• AMD Heterogeneous System Architecture (HSA) 2.0
• SIP blocks: Unified Video Decoder, Video Coding Engine, TrueAudio^[36]
• Dual-channel (2x64-bit) DDR3 memory controller
• Integrated custom ARM Cortex-A5 co-processor^[37] with TrustZone Security Extensions^[38]

'Carrizo' (2015)[edit]

• Fabrication 28 nm
• Socket FP4
• Up to 4 'Excavator' x86 CPU cores
• MMX, SSE, SSE2, SSE3, SSSE3, SSE4.1, SSE4.2, SSE4a, AMD64, AMD-V, AES, CLMUL, AVX, AVX 1.1, AVX2, XOP, FMA3, FMA4, F16C, ABM, BMI1, BMI2, TBM, RdRand, Turbo Core
• GPU based on Graphics Core Next 1.2

'Bristol Ridge' (2016)[edit]

• Fabrication 28 nm
• Socket FP4^[68]
• 'Excavator v2' x86 CPU cores
• MMX, SSE, SSE2, SSE3, SSSE3, SSE4.1, SSE4.2, SSE4a, AMD64, AMD-V, AES, CLMUL, AVX, AVX 1.1, AVX2, XOP, FMA3, FMA4, F16C, ABM, BMI1, BMI2, TBM, RdRand, Turbo Core
• GPU based on Graphics Core Next 1.2 with VP9 decoding

'Raven Ridge' (2017)[edit]

• Fabrication 14 nm by GlobalFoundries
• Transistors: 4.95 billion
• Socket AM4/FP5
• Die size: 210 mm²
• Zen CPU cores
• MMX, SSE, SSE2, SSE3, SSSE3, SSE4.1, SSE4.2, SSE4a, AMD64, AMD-V, AES, CLMUL, AVX, AVX 1.1, AVX2, FMA3, F16C, ABM, BMI1, BMI2, RdRand, Turbo Core
• Fifth generation GCN based GPU

1. ^AMD defines 1 kilobyte (KB) as 1024 bytes, and 1 megabyte (MB) as 1024 kilobytes.^[44]
2. ^Unified Shaders : Texture Mapping Units : Render Output Units and Compute Units (CU)
3. ^Single precision performance is calculated from the base (or boost) core clock speed based on a FMA operation.

'Picasso' (2019)[edit]

• Fabrication 12 nm by GlobalFoundries
• Socket AM4/FP5
• Zen+ CPU cores
• MMX, SSE, SSE2, SSE3, SSSE3, SSE4.1, SSE4.2, SSE4a, AMD64, AMD-V, AES, CLMUL, AVX, AVX 1.1, AVX2, FMA3, F16C, ABM, BMI1, BMI2, RdRand, Turbo Core
• Dual-channel DDR4 memory controller
• Fifth generation GCN based GPU

1. ^AMD defines 1 kilobyte (KB) as 1024 bytes, and 1 megabyte (MB) as 1024 kilobytes.^[44]
2. ^Unified Shaders : Texture Mapping Units : Render Output Units and Compute Units (CU)
3. ^Single precision performance is calculated from the base (or boost) core clock speed based on a FMA operation.

Ultra-mobile APUs[edit]

Brazos: 'Desna', 'Ontario', 'Zacate' (2011)[edit]

• Fabrication 40 nm by TSMC
• Socket FT1 (BGA-413)
• Based on the Bobcat microarchitecture^[98]
• MMX, SSE, SSE2, SSE3, SSSE3, SSE4a, ABM, NX bit, AMD64, AMD-V
• DirectX 11 integrated graphics with UVD 3.0
• Z-series denote Desna; C-series denote Ontario; and the E-series denotes Zacate
• 2.50 GT/s UMI (PCIe 1.0 ×4)

Brazos 2.0: 'Ontario', 'Zacate' (2012)[edit]

• Fabrication 40 nm by TSMC
• Socket FT1 (BGA-413)
• Based on the Bobcat microarchitecture^[98]
• MMX, SSE, SSE2, SSE3, SSSE3, SSE4a, ABM, NX bit, AMD64, AMD-V
• PowerNow!
• DirectX 11 integrated graphics
• C-series denote Ontario; and the E-series denotes Zacate
• 2.50 GT/s UMI (PCIe 1.0 ×4)

Brazos-T: 'Hondo' (2012)[edit]

• Fabrication 40 nm by TSMC
• Socket FT1 (BGA-413)
• Based on the Bobcat microarchitecture^[98]
• Found in tablet computers
• MMX, SSE, SSE2, SSE3, SSSE3, SSE4a, ABM, NX bit, AMD64, AMD-V
• PowerNow!
• DirectX 11 integrated graphics
• 2.50 GT/s UMI (PCIe 1.0 ×4)

'Kabini', 'Temash' (2013)[edit]

• Fabrication 28 nm by TSMC
• Socket FT3 (BGA)
• 2 to 4 CPU Cores (Jaguar (microarchitecture))
• MMX, SSE, SSE2, SSE3, SSSE3, SSE4a, SSE4.1, SSE4.2, AVX, F16C, CLMUL, AES, MOVBE (Move Big-Endian instruction), XSAVE/XSAVEOPT, ABM, BMI1, AMD-V support
• Turbo Dock Technology, C6 and CC6 low power states
• GPU based on Graphics Core Next (GCN)
• AMD Eyefinity multi-monitor for up to two displays

Temash, Elite Mobility APU[edit]

Kabini, Mainstream APU[edit]

'Beema', 'Mullins' (2014)[edit]

• Fabrication 28 nm by GlobalFoundries
• Socket FT3b (BGA)
• CPU: 2 to 4 (Puma cores)
• GPU based on Graphics Core Next (GCN)
• MMX, SSE, SSE2, SSE3, SSSE3, SSE4a, SSE4.1, SSE4.2, AVX, F16C, CLMUL, AES, MOVBE (Move Big-Endian instruction), XSAVE/XSAVEOPT, ABM, BMI1, AMD-V support
• Intelligent Turbo Boost
• Platform Security Processor, with an integrated ARM Cortex-A5 for TrustZone execution

Mullins, Tablet/2-in-1 APU[edit]

Beema, Notebook APU[edit]

'Carrizo-L' (2015)[edit]

• Fabrication 28 nm by GlobalFoundries
• Socket FT3b (BGA), FP4 (µBGA)^[101]
• CPU: 2 to 4 (Puma+ cores)
• GPU based on Graphics Core Next (GCN)
• MMX, SSE, SSE2, SSE3, SSSE3, SSE4a, SSE4.1, SSE4.2, AVX, F16C, CLMUL, AES, MOVBE (Move Big-Endian instruction), XSAVE/XSAVEOPT, ABM, BMI1, AMD-V support
• Intelligent Turbo Boost
• Platform Security Processor, with an integrated ARM Cortex-A5 for TrustZone execution
• All models except A8-7410 available in both laptop and all-in-one desktop versions

'Stoney Ridge' (2016)[edit]

• Fabrication 28 nm by GlobalFoundries
• Socket FP4^[68]
• 2 'Excavator v2' x86 CPU cores
• MMX, SSE, SSE2, SSE3, SSSE3, SSE4.1, SSE4.2, SSE4a, AMD64, AMD-V, AES, CLMUL, AVX, AVX 1.1, AVX2, XOP, FMA3, FMA4, F16C, ABM, BMI1, BMI2, TBM, RdRand, Turbo Core
• GPU based on Graphics Core Next 3rd Generation with VP9 decoding

Embedded APUs[edit]

G-Series[edit]

Brazos: 'Ontario' and 'Zacate' (2011)[edit]

• Fabrication 40 nm
• Socket FT1 (BGA-413)
• CPU microarchitecture: Bobcat^[103]
• MMX, SSE, SSE2, SSE3, SSSE3, SSE4a, ABM, NX bit, AMD64, AMD-V
• GPU microarchitecture: TeraScale 2 (VLIW5) 'Evergreen'
• Memory support: single-channel, support up to two DIMMs of DDR3-1333 or DDR3L-1066
• 5 GT/s UMI

'Kabini' (2013, SoC)[edit]

• Fabrication 28 nm
• Socket FT3 (769-BGA)^[104]
• CPU microarchitecture: Jaguar
• MMX, SSE, SSE2, SSE3, SSSE3, SSE4a, SSE4.1, SSE4.2, AVX, F16C, CLMUL, AES, MOVBE (Move Big-Endian instruction), XSAVE/XSAVEOPT, ABM, BMI1, AMD-V support. No support for FMA (Fused Multiply-Accumulate).
• GPU microarchitecture: Graphics Core Next (GCN)
• hardware acceleration for video decode through Unified Video Decoder 3 (H.264, VC-1, MPEG2, etc.) and new video encode capability not available in previous AMD Embedded G-Series APU
• Single channel DDR3-1600, 1.25 and 1.35 V voltage levels support, support for ECC memory
• integrates Controller Hub functional block as well
• Trusted Platform Module (TPM) 1.2 support
• integrates HD audio and 2 SATA channels
• integrates USB 2.0 and USB 3.0 (GX-210JA no USB 3.0)^[105]

'Steppe Eagle' (2014, SoC)[edit]

• Fabrication 28 nm
• Socket FT3b (769-BGA)
• CPU microarchitecture: Puma
• MMX, SSE, SSE2, SSE3, SSSE3, SSE4a, SSE4.1, SSE4.2, AVX, F16C, CLMUL, AES, MOVBE (Move Big-Endian instruction), XSAVE/XSAVEOPT, ABM, BMI1, AMD-V support

Amd Apu A6 3620 Video Controller Driver Reviews

'Crowned Eagle' (2014, SoC)[edit]

• Fabrication 28 nm
• Socket FT3b (769-BGA)
• CPU microarchitecture: Puma
• MMX, SSE, SSE2, SSE3, SSSE3, SSE4a, SSE4.1, SSE4.2, AVX, F16C, CLMUL, AES, MOVBE (Move Big-Endian instruction), XSAVE/XSAVEOPT, ABM, BMI1, AMD-V support
• no GPU

I-Family: 'Brown Falcon' (2016, SoC)[edit]

• Fabrication 28 nm
• Socket FP4^[106]
• 2 or 4 'Excavator' x86 cores with 1MB shared L2 cache
• MMX, SSE, SSE2, SSE3, SSSE3, SSE4.1, SSE4.2, SSE4a, AMD64, AMD-V, AES, CLMUL, AVX, AVX 1.1, AVX2, XOP, FMA3, FMA4, F16C, ABM, BMI1, BMI2, TBM, RdRand
• GPU microarchitecture: Graphics Core Next (GCN) (up to 4 CUs) with support for DirectX 12
• Dual channel 64-bit DDR4 or DDR3 memory with ECC
• 4K × 2K H.265 decode capability and multi format encode and decode
• Integrated Controller Hub supports: PCIe 3.0 1×4, PCIe 2/3 4×1, 2 USB3 + 2 USB2 ports, 2 SATA 2.0/3.0 ports

J-Family: 'Prairie Falcon' (2016, SoC)[edit]

• Fabrication 28 nm
• Socket FP4^[109]
• 2 'Excavator' x86 cores with 1MB shared L2 cache
• MMX, SSE, SSE2, SSE3, SSSE3, SSE4.1, SSE4.2, SSE4a, AMD64, AMD-V, AES, CLMUL, AVX, AVX 1.1, AVX2, XOP, FMA3, FMA4, F16C, ABM, BMI1, BMI2, TBM, RdRand
• GPU microarchitecture: Radeon R5E Graphics Core Next (GCN) (up to 3 CUs) with support for DirectX 12
• Single channel 64-bit DDR4 or DDR3 memory
• 4K × 2K H.265 decode capability with 10-bit compatibility and multi format encode and decode
• Integrated Controller Hub supports: PCIe 3.0 1×4, PCIe 2/3 4×1, 2 USB3 + 2 USB2 ports, 2 SATA 2.0/3.0 ports

LX-Family (2016, SoC)[edit]

• Fabrication 28 nm
• Socket FT3b (769-BGA)
• 2 “Puma” x86 cores with 1MB shared L2 cache
• MMX, SSE, SSE2, SSE3, SSSE3, SSE4a, SSE4.1, SSE4.2, AVX, F16C, CLMUL, AES, MOVBE (Move Big-Endian instruction), XSAVE/XSAVEOPT, ABM, BMI1, AMD-V support
• GPU microarchitecture: Graphics Core Next (GCN) (1CU) with support for DirectX 11.2
• Single channel 64-bit DDR3 memory with ECC
• Integrated Controller Hub supports: PCIe® 2.0 4×1, 2 USB3 + 4 USB2 ports, 2 SATA 2.0/3.0 ports

R-Series[edit]

Comal: 'Trinity' (2012)[edit]

• Fabrication 32 nm
• Socket FP2 (BGA-827), FS1r2
• CPU microarchitecture: Piledriver
• MMX, SSE, SSE2, SSE3, SSSE3, SSE4a, SSE4.1, SSE4.2, AMD64, AMD-V, AES, CLMUL, AVX 1.1, XOP, FMA3, FMA4, F16C^[23], ABM, BMI1, TBM
• GPU microarchitecture: TeraScale 3 (VLIW4) 'Northern Islands'
• Memory support: dual-channel 1.35 V DDR3L-1600 memory, in addition to regular 1.5 V DDR3
• 2.5 GT/s UMI
• Die size: 246 mm²; Transistors: 1.303 billion
• OpenCL 1.1 and OpenGL 4.2 support

'Bald Eagle' (2014)[edit]

• Fabrication 28 nm
• Up to 4 'Steamroller' x86 cores^[110]
• MMX, SSE, SSE2, SSE3, SSSE3, SSE4a, SSE4.1, SSE4.2, AMD64, AMD-V, AES, CLMUL, AVX 1.1, XOP, FMA3, FMA4, F16C^[23], ABM, BMI1, TBM
• GPU microarchitecture: Graphics Core Next (GCN) (up to 8 CUs) with support for DirectX 11.1 and OpenGL 4.2
• Dual channel DDR3 memory with ECC
• Unified Video Decode (UVD) 4.2 and Video Coding Engine (VCE) 2.0

Amd A6 3650 Drivers

'Merlin Falcon' (2015, SoC)[edit]

• Fabrication 28 nm
• Up to 4 'Excavator' x86 cores^[111]
• MMX, SSE, SSE2, SSE3, SSSE3, SSE4.1, SSE4.2, SSE4a, AMD64, AMD-V, AES, CLMUL, AVX, AVX 1.1, AVX2, XOP, FMA3, FMA4, F16C, ABM, BMI1, BMI2, TBM, RdRand
• GPU microarchitecture: Graphics Core Next (GCN) (up to 8 CUs) with support for DirectX 12
• Dual channel 64-bit DDR4 or DDR3 memory with ECC
• Unified Video Decode (UVD) 6 (4K H.265 and H.264 decode) and Video Coding Engine (VCE) 3.1 (4K H.264 encode)
• Dedicated AMD Secure Processor supports secure boot with AMD Hardware Validated Boot (HVB)
• Integrated FCH featuring PCIe 3.0 USB3.0, SATA3, SD, GPIO, SPI, I2S, I2C, UART

'V1000' (2018, SoC)[edit]

• Fabrication 14 nm by GlobalFoundries
• Up to 4 'Zen' cores
• Socket FP5
• MMX, SSE, SSE2, SSE3, SSSE3, SSE4.1, SSE4.2, SSE4a, AMD64, AMD-V, AES, CLMUL, AVX, AVX 1.1, AVX2, FMA3, F16C, ABM, BMI1, BMI2, RdRand, Turbo Core
• Dual channel DDR4 memory with ECC
• Fifth generation GCN based GPU

Amd A6 3620 Upgrade

1. ^AMD defines 1 kilobyte (KB) as 1024 bytes, and 1 megabyte (MB) as 1024 kilobytes.^[44]
2. ^Unified Shaders : Texture Mapping Units : Render Output Units and Compute Units (CU)
3. ^Single-precision performance is calculated from the base (or boost) core clock speed based on a FMA operation.

'R1000' (2019, SoC)[edit]

• Fabrication 14 nm by GlobalFoundries
• Up to 2 'Zen' cores
• Socket FP5
• MMX, SSE, SSE2, SSE3, SSSE3, SSE4.1, SSE4.2, SSE4a, AMD64, AMD-V, AES, CLMUL, AVX, AVX 1.1, AVX2, FMA3, F16C, ABM, BMI1, BMI2, RdRand, Turbo Core
• Dual channel DDR4 memory with ECC
• Fifth generation GCN based GPU

1. ^AMD defines 1 kilobyte (KB) as 1024 bytes, and 1 megabyte (MB) as 1024 kilobytes.^[44]
2. ^Unified Shaders : Texture Mapping Units : Render Output Units and Compute Units (CU)
3. ^Single-precision performance is calculated from the base (or boost) core clock speed based on a FMA operation.

Custom APUs[edit]

As of May 1, 2013, AMD opened the doors of their 'semi-custom' business unit.^[112] Since these chips are custom-made for specific customer needs, they vary widely from both consumer-grade APUs and even the other custom-built ones. Some notable examples of semi-custom chips that have come from this sector include the chips from the PlayStation 4 and Xbox One.^[113] So far the size of the integrated GPU in these semi-custom APUs exceed by far the GPU size in the consumer-grade APUs.

1. ^Unified Shaders : Texture Mapping Units : Render Output Units
2. ^Precision performance is calculated from the base (or boost) core clock speed based on a FMA operation.
3. ^Pixel fillrate is calculated as the number of ROPs multiplied by the base (or boost) core clock speed.
4. ^Texture fillrate is calculated as the number of TMUs multiplied by the base (or boost) core clock speed.
5. ^Feature preview of Rapid Packed Math, introduced in GCN 5 Vega.

See also[edit]

Notes[edit]

Note 1: The clock multiplier applies to the 200 MHz base clock. (AMD default clock base is 200 MHz)
Note 2:Unified shader processors (USPs): Texture mapping units (TMUs): Render output units (ROPs). 1 CU (Compute Unit) = 64 USPs: 4 TMUs : 1 ROPs
Note 3: Models enabled by Turbo Core technology, up to 10% clock speed increase is planned. With CPU boost, only one core of a dual-core model has boost enabled.
Note 4: K models feature an unlocked multiplier and overclockable GPU.
Note 5: One AMD module consists of two integer cores and two FPUs, which can be combined into one wide FPU for executing certain instructions, such as FMA. The two cores share certain resources, but are two separate units.

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External links[edit]

Amd Apu A6 3620 Video Controller Driver Windows 7